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  product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 1 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 0.8mm pitch mini pci express connector
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 2 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 1.0scope 3 2.0applicabledocumet ...3 3.0requiremets.3 4.0ratigs 3 5.0evirometalperformace .4 mechaicalperformace. 5 6.0productqualificatioadrequalificatiotest sequece 8
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 3 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 1.0 scope this product specification covers the performance r equirements for the 0.8mm pitch mini pci express connector . 1.1 productameadpartumber productname seriesnumber 0.8mm pitch mini pci express connector 48338 0.8mm pitch mini-pci express connector,sink type 48344 2.0 applicabledocumet thefollowingdocumentsformapartofthisspecificat iontotheextentspecifiedherein.intheeventof conflictbetweentherequirementsofthisspecificat ionandtheproductdrawing,theproductdrawingshal ltake precedence.intheeventofconflictbetweenthere quirementsofthisspecificationandthereferenced documents,thisspecificationshalltakeprecedence. eia364 3.0 requiremets seetheappropriatesalesdrawings.forinformatio nondimensions,materials,plantingsandmarkings. sd48338002,sd48338004,sd48344001,rsd4834 4001 4.0ratigs 4.1voltage voltagerating:50vac 4.2curret currentrating:0.5a 4.3temperature operating: 40cto+85c non-operating : 40cto+85c includingterminaltemperaturerise.
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 4 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 5.0 performace 5.1testrequiremetsadproceduressummary item descriptio testcoditio requiremet 1 examinationofproduct visualinspection meetsrequirementsofproduct drawing.nophysicaldamage. 5.2electricalrequiremets item descriptio testcoditio requiremet 2 contactresistance (lowlevel) mateconnectors,measurebydrycircuit, 20mvmax.,100mamax. eia 364 23 55milliohmsmax.(initial) aftertest:r:20milliohmmax. 3 insulationresistance mateconnectors,apply500vdc betweenadjacentterminalorground. eia36421 500megohmmin. 4 dielectric withstanding voltage mateconnectors;apply300vacfor1 minutebetweenadjacentterminalor ground. eia36420 nobreakdown; currentleakage:1mamax. 5 temperaturerise mateconnectorsandmeasurethe temperatureriseofcontactwhenthe maximumacratedcurrent0.5ais passed. eia 364 70 temperaturerise:30cmax. 6 insertion loss a common test fixture for connector characterization shall be used. this is differential insertion loss requirement. eia-364-101 1db max. up to 1.25 ghz; Q [1.6*(f-1.25)+1] db for 1.25 ghz product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 5 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 9 mating / unmating force card mating/unmating sequence: a.) insert the card at the angle specified by the manufacturer b.) rotate the card into position. c.) reverse the installation sequence to unmated operation speed 25.4 3 mm/minute. measure the force required to mate/unmate connector. eia36413 force: 2.3kgf max 10 durability the sample should be mounted in the tester and fully mated and unmated 50 cycles specified at the rate of 25.4 3 mm/min. eia36409 20 milliohms max. (change from initial) 11 vibration the electrical load condition shall be 100 ma maximum for all contacts. subject to a simple harmonic motion having amplitude of 0.76mm (1.52mm maximum total excursion) in frequency between the limits of 10 and 55 hz. the entire frequency range, from 10 to 55 hz and return to 10 hz, shall be traversed in approximately 1 minute. this motion shall be applied for 2 hours in each of three mutually perpendicular directions. eia-364-28 20 milliohms max. (change from initial) & discontinuity< 1 microsecond 12 shock (mechanical) subject mated connectors to 50 gs (peak value) half-sine shock pulses of 11 milliseconds duration. three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks). the electrical load condition shall be 100ma maximum for all contacts. eia-364-27 20 milliohms max. (change from initial) & discontinuity< 1 microsecond 13 terminal / housing retention force apply axial pull out force at the speed rate of 25 / 3 mm/minute on the terminal assembly in the housing 2.5 n min. 14 nail / housing retention force apply axial pull out force at the speed rate of 25 / 3 mm/minute on the terminal assembly in the housing 2.5 n min.
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 6 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 15 thermal shock mate module and subject to follow condition for 10 cycles. 1 cycles: -55 +0/-3 m, 30 minutes +85 +3/-0 m, 30 minutes eia-364-32 20 milliohms max. (change from initial) & visual: no damage 16 cyclic temperature and humidity mate module and subject to 5 cycle. between 25 +/- 3 at 80% +/- 3% rh. and 65 +/- 3 at 50% +/- 3% rh. dwell time of 1 hour; ramp time of 0.5 hours. 24 cycles. (eia-364-31, test condition a) 20 milliohms max. (change from initial) & visual: no damage 17 temperature life subject mated connectors to temperature life at 85 3 for 96 hours. measure signal. (eia-364-17, test condition a) 20 milliohms max. (change from initial) & visual: no damage 18 salt spray subject mated/unmated connectors to 5% salt-solution concentration,35 2 fo r 48 hours. (eia-364-26,test condition b) 20 milliohms max. (change from initial) & visual: no damage 19 solderability subject the test area of contacts into the flux for 5-10 sec. and then into solder bath, temperature at 245 5 , for 4-5 sec. (eia-364-52) solder able area shall have minimum of 95% solder coverage. 20 hand soldering hand soldering: temperature:3605m, 3 sec. visual: no damage
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 7 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 21 resistancetosoldering heat infraredreflowconditions 260 maximum(peaktemperature) 8minutesmaximum 250 max. 2040sec. 3 maximum/second averagerangeup 180sec.30sec. (preheattemperature:150~200 maximum) temperatureconditiongraph (temperatureonboardpatternside) appearance:nodamage after1timeofreflow
product specification revision: ecr/ecn information: title: 0.8mm pitch mini pci express connector sheet no. b1 ec no: s2011-0490 8 of 8 date: 2010 /11/30 document number: created / revised by: checked by: approved by: ps - 48338 - 002 jessiechua 2010/11/30 ksshantha 2010/11/30 nageshkn 2010/12/03 template filename: product_spec[size_a4](v.1).doc 6.0productqualificatioadrequalificatiotest sequece testitem testgroup a b c d e f g h i j k examination of product 1,10 1,5 1,9 1,3 1,3 contact resistance (low level) 1,5 1,4 2,7 2,4 1,7 2,8 insulation resistance 3,8 2,5 3,6 dielectric withstanding voltage 4,9 3,6 4,7 temperature rise 4 insertion loss 1 return loss 2 next cross-talk 3 mating / unmating force 2,4 durability 3 vibration 2 shock (mechanical) 3 terminal / housing retention force 1 nail / housing retention force 2 thermal shock 5 cyclic temperature and humidity 6 temperature life 5 salt spray 3 solderability 1 hand soldering 2 resistance to soldering heat 2 samplesize* 5 5 5 5 5 5 5 5 5 5 5 alltestsamplesneedtobepcbmounted.


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